Stannous Sulfate

Catalog Number	ACEP7488553-1
CAS Number	7488-55-3
Structure
Synonyms	Tin sulphate; SnSo4, Stannous sulphate
Molecular Weight	214.77
Molecular Formula	SnSO4
Appearance	White crystal or powder
Application	It is a main raw material for electroplating industry of tin and aluminum alloy surface treatment.
Assay	99% min.
Chemical Name	Stannous Sulfate
Content	Alkaline Earth Metal: 0.01% max. Chloride: 0.005% max. Fe: 0.005% max. Pb: 0.02% max.
EC Number	231-302-2
Insolubility	HCl Insoluble: 0.005% max.
Packaging	5kg/fresco bag, 25kg/ fibre drum or 25kg/plastic drum

Case Study

The Role of Stannous Sulfate (SnSO₄) in Electrochemical Co-Deposition of Cu-Sn Alloy for Ni Undercoating Substitution

Jung, Minkyeong, Gibaek Lee, and Jinsub Choi. Electrochimica Acta 241 (2017): 229-236.

This study investigates the use of stannous sulfate (SnSO₄) in the electrochemical co-deposition of a Cu-Sn alloy as a potential substitute for the Ni undercoating layer in various coating applications. The electrodeposition process was carried out in a sulfuric acid bath, using a 1:1 molar ratio of Cu to Sn (0.1 M CuSO₄ and 0.1 M SnSO₄), along with several additives, including complex agents (EDTP and TEA), a chelating agent (ethylenediamine), and a pit prevent agent (potassium tetrathionate).
The study found that the inclusion of SnSO₄ in the bath, in combination with the additives, led to uniform co-deposition of Cu and Sn. Cyclic voltammetry results indicated that SnSO₄ helps to shift the reduction onset potential of copper, allowing for a more uniform coating of the Cu-Sn alloy. This process, under optimized conditions (1 A dm^-2 and 30 minutes), resulted in a bright-white, uniform, and compact coating, as confirmed by SEM, EDS mapping, XPS, and XRD analyses.
The findings demonstrate that SnSO₄ plays a crucial role in facilitating the smooth co-deposition of Cu-Sn alloys, offering a viable alternative to traditional Ni undercoating layers. This approach could be particularly advantageous in applications where environmental or cost concerns drive the need for alternative electroplating processes.

The Role of Stannous Sulfate (SnSO₄) in Tin Plating from Acidic Gluconate Solutions

Survila, A., et al. "Tin plating in acid Sn (II) gluconate solutions containing excess of sulphate." Transactions of the IMF 91.4 (2013): 197-201.

This study investigates the use of stannous sulfate (SnSO₄) in acid-based Sn(II) gluconate solutions for tin plating applications. Electrochemical techniques, including voltammetry, electrochemical impedance spectroscopy (EIS), SEM, and XRD, were used to examine the plating process in solutions containing SnSO₄, sodium gluconate (NaC₆H₁₁O₇), and sodium sulfate (Na₂SO₄). The results indicate that the solution pH significantly influences the reduction rate of Sn(II), with an increase in pH leading to a 100-fold increase in electrode impedance and a notable reduction in the limiting current density.
For successful tin plating, the presence of gluconate is critical to the quality of the coating. At low cathodic polarization, spongy tin deposits form when gluconate is insufficient, while increasing gluconate concentration leads to the formation of fine-grained, compact tin coatings. The reduction process is characterized by strong inhibition, involving the chemisorption of gluconate and its incorporation into the deposits.
The study highlights that SnSO₄ plays a key role in promoting tin electrodeposition under controlled conditions, contributing to smooth, uniform, and high-quality coatings when the solution is properly optimized with respect to pH and gluconate concentration. This research provides valuable insights for industries seeking efficient and controlled tin plating techniques, particularly in applications where uniform coatings are crucial.

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