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Alfa Chemistry provides electroplating intermediates for copper plating, which is an important part of the process. Our copper-plated intermediates can be used in a variety of industries and commercial applications.
Copper plating is an electrochemical process in which a layer of copper is deposited on a solid metal surface by using an electric current. Copper plating is the most widely used pre coating in the electroplating industry, including tin solders, lead tin alloys, and zinc die castings. Copper plating is required before nickel, gold, and silver plating. This process is not only used to improve the coating adhesion, but also can provide valuable corrosion protection.
The structure and function of some copper plating intermediates are introduced here, which can provide reference for your research work.
| Structure and Function of Copper Plating Intermediates | ||
|---|---|---|
| SP | Polydipropyl sulfonate | SP is used as grain refiner in acid copper plating bath to increase current density. It has a remarkable effect in combination with M, N, PN, GISS and AESS. It has a wide application range and can increase or decrease with temperature. |
| HP | Alcoholpropane sulfonate | HP is a kind of grain refiner used in acid copper plating bath instead of traditional SP, which can achieve bright and elegant copper coating with intermediates such as PN, GISS, MESS, N, P and so on. |
| BSP | Phenyl polydipropyl sulfonate | The effect of BSP is basically the same as that of SP, and its leveling ability is stronger because of the action of benzene ring. |
| SH110 | Thiazolinyl polydipropyl sulfonate | The function is basically the same as SP, but the difference is that it is a combination of grain refiner and leveling agent, and this process is especially suitable for circuit board electroplating. |
| PN | Polyvinyl alkylimine | PN is a kind of high molecular polymer, which needs to be used in conjunction with SP, M, N, P, AESS, GISS and so on. It is the best high temperature carrier of copper acid brightener and is suitable for complex electroplating. |
| AESS | Wliphatic amine oxyethylate sulfonate | AESS is a powerful acid copper shift agent. The addition of AESS to the plating bath can obviously improve the brightness and flatness of the low area, and has a certain wetting effect. It should be used in combination with SP, M, GISS, N, P, etc. |
| GISS | Polyvinyl alkylimine compound | GISS is a high performance shift agent formed by condensation of polyethyleneimine under specific conditions. It has excellent translocation performance in low area and usually needs to be used in combination with SP, M, N, AESS, PN, P; GISS can be used not only in copper acid acid, but also in low cyanide zinc plating brightener. |
| TPS | Dimethylformamide sulfonate | The performance of TPS is similar to that of SP, and its high temperature translocation performance is excellent; brightener is a new generation of high performance copper plating intermediate to replace SP and M, and usually needs to be used in conjunction with GISS, PN, P, N, etc. |
| MPS | 3-mercapto-1-propanesulfonic acid sodium salt | The performance of MPS is similar to that of SP, and it has excellent translocation performance at high temperature. It is a new generation of high performance copper acid intermediate, which usually needs to be used with SP, GISS, PN, P, N and so on. |
| DPS | N,N-dimethyl-dithiocarbamylpropyl sulfonic acid | The low grain refiner in copper acid can be used in combination with polyethers and wetting agents, and can also be used in combination with other sulfur-containing brighteners to obtain coatings with good brightness and ductility. It can be used for electroless plating of precious metals and can also be used as electroplating stabilizer. |
| UPS | 3-S-Isothiuroniumpropylsulfonate | UPS is used as a high position grain refiner in acid copper plating bath, which has strong filling ability in high and middle area, fast light output speed, improved bath stability and current efficiency. |
| ZPS | 3-(Benzothiazolyl-2-mercapto)-propyl sulfonate | ZPS is a brightener for copper plating. It can be used in combination with polyether and wetting agent, or with other sulfur containing brighteners. It can also be used for electroless plating of precious metals. |
| M | 2-Mercaptobenzimidazole | It is a good brightener and leveling agent. It can be used to plate the all-optical coating with excellent leveling property and good toughness in a wide temperature range. |
| MBT | 2-Mercaptobenzothiazole | MBT acts in the acid copper plating solution and is an excellent leveling agent for the middle and low areas. The bright coating with excellent leveling performance can be plated in a wide temperature range, which usually needs to be used together with N. |
| MESS | Mercaptimidazole propane sulfonate | MESS acts in acidic copper plating bath and is an excellent medium and low brightener. |
| ADSS | Copper acid leveling agent | The performance of ADSS is similar to that of POSS, with strong acid resistance, high temperature resistance and wide dosage range. |
| POSS | Acid copper strong leveling agent | It has excellent leveling and glossiness, and bright coating can be obtained in the range of 0.2~10A/dm2. |
| CPSS | Copper acid leveling agent | The filling ability of high, middle and low areas is very strong, the light speed is very fast, and the position of low areas is very strong, high temperature resistance, above 40°C. |
| N | Disolfstay sulfourea | N and M can be plated in a wide temperature range of flatness, good toughness coating, its temperature range is very wide, adding a small amount can obtain excellent results. |
| H1 | Terahydrozoline thioketone | H1 usually cooperates with SP, PN, P, GISS, etc., and has the same effect on M and N, and has a strong leveling property. |
| P | PEG 6000-10000 | P must be used in combination with other acid copper intermediates to obtain a full bright coating. |
| MT-580 | MT-580 Succinic acid sodium | Adding an appropriate amount of MT-580 to the bath solution can effectively prevent pinholes, and its displacement and leveling are very good. |
| MT-800 | β-naphthol alkyl compound | MT-800 can effectively prevent the formation of pinholes and low bubbles in the coating, and its displacement and leveling are excellent. It does not produce hydrophobic film, which can effectively restrain the decomposition of photoagent and improve the stability of the bath. |
| AEO | Fatty amine polyoxyethylene | As the low zone displacement agent in the acid copper plating bath, the brightness and flatness of the low zone can be obviously improved by adding AESS to the plating bath. It is usually used in conjunction with SP, M, GISS, etc. |
| USS | Acid copper strong bright leveling agent | USS is a strong acid copper transposition agent to improve the brightness and flatness of low areas. It is usually used in combination with GISS, P, N, etc. |
| PPNI | Hexyl benzyl amine salt | In acid copper plating, it shows a faster light output speed, and shows the top filling performance of high, medium and low areas, no fault phenomenon, no hydrophobic film. |
As a supplier of electroplating chemicals, Alfa Chemistry has always shown great interest in copper plating intermediates. Alfa Chemistry is committed to providing a wide range of copper plating intermediates. If you do not find what you need, please contact us. We also offer product customization according to customer's detailed requirements.
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