Electroplating Intermediate

Process Flow

After introducing Potassium Perfluorooctanesulfonate from Alfa Chemistry, we made adjustments and optimizations to our process as follows:

1.Plating Solution Formulation

• Chromium Trioxide (CrO₃): 250 g/L
• Sulfuric Acid (H₂SO₄): 2.5 g/L
• Potassium Perfluorooctanesulfonate: 0.04–0.06 g/L

2.Process Conditions

• Temperature: 45–50℃
• Current Density: 15–20 A/dm²
• Stirring Speed: 150 rpm
• Plating Time: 8–12 minutes

3.Addition Method

Potassium Perfluorooctanesulfonate was directly added to the stirred solution, with surface tension monitored every 24 hours to maintain a range of 28–30 mN/m.

Results

After three continuous months of production testing, Potassium Perfluorooctanesulfonate demonstrated remarkable performance improvements:

• Coating Thickness Uniformity

Before: ±3.5 μm deviation in thickness;

After: ±1.2 μm deviation, with a 35% improvement in corner coverage.

• Surface Smoothness

The surface roughness (Ra value) decreased from 0.32 μm to 0.18 μm, improving by 43%.

• Reduced Pinholes and Bubbles

Microscopic observation showed a reduction in pinholes from 12 per square centimeter to 1–2, and bubbles were virtually eliminated.

• Enhanced Corrosion Resistance

In a 72-hour salt spray test (ASTM B117), samples without Potassium Perfluorooctanesulfonate showed corrosion after 48 hours, while samples with the additive showed no visible corrosion after 72 hours, improving corrosion resistance by about 30%.

• Improved Production Efficiency

With more stable coating quality, the rework rate dropped from 6% to 2%, improving overall production efficiency by about 20%.

Process Flow

After discussing with Alfa Chemistry's technical team, we incorporated DPS into our copper plating process with the following parameters:

1.Plating Solution Components

• Copper Sulfate (CuSO₄·5H₂O): 250 g/L
• Sulfuric Acid (H₂SO₄): 50 g/L
• Chloride Ion (Cl⁻): 50 mg/L
• DPS: 5 mg/L

2.Process Conditions

• Temperature: 25°C
• Current Density: 2 A/dm²
• Stirring Speed: 100 rpm
• Time: 20 minutes

3.Addition Method

DPS was added directly to the stirred solution at a concentration of 5 mg/L, then stirred for 15 minutes before starting the plating process.

Results

Before using DPS, our copper plating process faced issues with poor hole filling, rough coatings, and cracks. After introducing DPS, the process was significantly improved:

• mproved Micro-pore and Blind Hole Filling

The filling rate of micro-pores and blind holes increased from 85% to 98%, greatly enhancing coating integrity and conductivity in HDI boards and micro-structured devices.

• Improved Coating Thickness Uniformity

Scanning electron microscope (SEM) analysis showed a reduction in thickness deviation from ±5 μm to ±1.2 μm, with a 35% improvement in overall flatness.

• Suppression of Pinholes and Roughness

The surface roughness (Ra) decreased from 0.8 μm to 0.3 μm, significantly improving coating density and smoothness.

• Improved Stress and Crack Resistance

After 500 cycles of thermal shock testing, the coatings showed no cracks or peeling, indicating good adhesion and internal stress control.

• Enhanced Conductivity and Corrosion Resistance

The resistivity of the coating decreased from 1.8 μΩ·cm to 1.2 μΩ·cm, improving conductivity by approximately 30%. In a 96-hour salt spray test (ASTM B117), no visible corrosion was observed, improving corrosion resistance by about 40%.

• Improved Production Efficiency and Yield

With more uniform coatings, polishing and rework rates decreased, improving production efficiency by 25%, and the first-pass yield increased from 93% to 99%.

Process Flow

After collaborating with Alfa Chemistry's technical team, we optimized the acid zinc plating process with the following parameters:

1.Plating Solution Components

• Zinc Chloride (ZnCl₂): 80 g/L
• Potassium Chloride (KCl): 220 g/L
• Boric Acid (H₃BO₃): 25 g/L
• Polyethylen/propylenglycol (beta-naphthyl) (3-sulfopropyl) diether Potassium: 0.5 g/L

2.Process Conditions

• Temperature: 30°C
• Current Density: 2 A/dm²
• pH: 5.0

3.Addition Method

Polyethylen/propylenglycol (beta-naphthyl) (3-sulfopropyl) diether Potassium was added to the solution at a concentration of 0.5 g/L, stirred well, and allowed to sit for 15 minutes before plating.

Results

Before introducing Polyethylen/propylenglycol (beta-naphthyl) (3-sulfopropyl) diether Potassium, our coatings were uneven in thickness and brightness, with poor corner coverage, which affected the overall performance. After using the intermediate, the results were significantly improved:

• Improved Coating Thickness Uniformity

Microscopic measurements showed that coating thickness uniformity on complex parts improved from ±3.5 μm to ±1.2 μm, with about 25% improvement in corner and recessed areas coverage.

• Enhanced Coating Brightness

After using Polyethylen/propylenglycol (beta-naphthyl) (3-sulfopropyl) diether Potassium, coating brightness (measured by gloss) increased from 65 GU to 92 GU, approaching a mirror-like finish, meeting the strict decorative requirements for automotive parts.

• Improved Coating Density and Corrosion Resistance

In a 96-hour salt spray test (ASTM B117), no rust was observed on the coating, showing a 40% improvement in corrosion resistance compared to control samples.

• Increased Current Efficiency, Reduced Production Costs

The plating process's current efficiency increased from 78% to 85%, reducing plating time by about 15%; rework rates decreased by 20%, reducing overall production costs by 10%.

• Enhanced Process Stability

The plating solution maintained good dispersion and stability even after continuous use for over 120 hours, without foaming or layering issues.