Nickel chloride solution

Catalog Number	ACEP7718549-2
CAS Number	7718-54-9
Structure
Molecular Weight	129.6
Molecular Formula	NiCl2

Case Study

Nickel-Chloride Bath for Efficient Electroforming of Pure Nickel Foils

Haghighi, Naghme Elahi, and Mohammad Jafar Hadianfard. Materials Chemistry and Physics 313 (2024): 128734.

Nickel-chloride (NiCl₂) baths are emerging as an effective method for electroforming pure nickel and nickel composites, offering a cost-efficient and simple alternative for producing high-precision parts. This study explored the electroforming of pure nickel foils using a nickel-chloride bath, focusing on key parameters such as saccharin concentration, nickel-chloride concentration, direct current density, and the choice of anode material.
The optimal bath composition was determined to be 80 g/L NiCl₂, with a direct current density of 1 A/dm² and a pH range of 4.5 - 6.3, which produced foils with improved surface quality, reduced roughness, and acceptable microhardness. Saccharin at 0.3 g/L significantly enhanced brightness and minimized internal stress, while insufficient saccharin led to defects like blistering and peeling.
The study also compared the use of graphite versus soluble nickel anodes. The graphite anode, while reducing cathode current efficiency to 44%, yielded foils with poorer quality compared to the nickel anode, which produced finer crystals with lower lattice strain and higher microhardness.
Overall, the nickel-chloride bath was demonstrated as a promising, low-cost method for producing high-quality electroformed nickel foils with a thickness of up to 75 μm, making it highly suitable for precision fabrication applications.

Electrodeposition of Ni-Mo-P Coating Using NiCl₂ as Electrolyte Component

Hu, Yiming, et al. Applied Catalysis A: General 662 (2023): 119267.

Experimental Steps
1)Preparation of Copper Sheet
Clean the Cu sheet (1 × 2 cm²) by painting one side, leaving an exposed area of 1 × 1 cm² for electrodeposition.
Ultrasonically treat the Cu sheet with acetone and 10 wt% H₂SO₄ for 10 minutes each to remove surface oxides and contaminants.
Rinse the treated Cu sheet with distilled water.
2)Electrolyte Preparation
Prepare the electrolyte by dissolving 0.05 M citric acid (C₆H₈O₇), 0.03 M ammonium heptamolybdate ((NH₄)₆Mo₇O₂₄), and 0.6 M nickel chloride (NiCl₂) in a ChCl-EG solvent.
Introduce different concentrations of sodium hypophosphite (NaH₂PO₂) into the solution at 0.1, 0.08, 0.066, and 0.05 M.
3)Electrodeposition Setup
Set up a three-electrode system consisting of the pretreated Cu sheet as the working electrode, a Pt flake (1.5 × 1.5 cm²) as the counter electrode, and a saturated calomel electrode (SCE) as the reference electrode.
Maintain a current density of 30 mA/cm² at 70°C for 5 minutes during the deposition process.
4)Coating Variations
Vary the NaH₂PO₂ concentration to produce coatings with different phosphorus content, including 0.6Ni-0.21Mo-0.1 P, 0.6Ni-0.21Mo-0.08 P, 0.6Ni-0.21Mo-0.066 P, and 0.6Ni-0.21Mo-0.05 P.
Also fabricate coatings without the addition of (NH₄)₆Mo₇O₂₄ or NaH₂PO₂ for comparison, labeled as 0.6Ni, 0.6Ni-0.1 P, and 0.6Ni-0.05 P.
5)Current Density Variation
Further optimize the hydrogen evolution reaction (HER) catalytic activity by fabricating coatings at different current densities of 7, 20, and 40 mA/cm² for the 0.6Ni-0.21Mo-0.066 P coatings.
This study highlights the application of NiCl₂ in the preparation of Ni-Mo-P coatings and its role in optimizing catalytic properties.

Application of Nickel Chloride for the Electroplating of Nickel/Graphene Coatings on Copper Substrates

Malayeri, Mahdi Aghaee, Hassan Koohestani, and Mohammad Tajally. Results in Engineering 18 (2023): 101167.

This study investigates the use of nickel chloride (NiCl₂) in the electroplating process to produce nickel/graphene oxide composite coatings on copper substrates, enhancing mechanical properties and surface protection.
A solution of nickel sulfate and nickel chloride was employed as the electrolyte, with boric acid and sodium dodecyl sulfate (SDS) added to improve bath performance. The electrolyte composition was carefully optimized, using 280 g/L of nickel sulfate, 50 g/L of nickel chloride, and 400 g/L of boric acid. A colloidal solution of graphene oxide (GO) (1 g/L) was introduced to the electrolyte to form a composite coating, aiming for high adhesion between the nickel layer and the copper substrate.
The electroplating process involved a direct current of 0.23 A and a voltage of 1.8 V, maintained for 60 minutes at a temperature of 35°C with a stirring rate of 300 rpm. Additionally, ultrasonic-assisted stirring was applied for 30 minutes with a pulse power of 200 W to enhance the dispersion of GO in the electrolyte. The plating bath's pH was controlled between 4 and 5. For electrolyte maintenance, 25% of the initial amount of nickel sulfate and nickel chloride were added after 30 minutes of plating. This study demonstrates the effectiveness of nickel chloride in the creation of nickel/graphene coatings, offering potential applications in improving copper material durability.

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