Copper(II) sulphate solution EPG

Catalog Number	ACEP7758987
CAS Number	7758-98-7
Structure
Molecular Formula	CuSO4

Case Study

Copper Sulfate (II) Solution Used for the Preparation of Nanocomposite Coatings Composed of Carbon Nanotubes and Copper

Marchewka, Jakub, et al. Scientific Reports 13.1 (2023): 6786.

Nanocomposite coatings composed of carbon nanotubes and various forms of copper were prepared using a two-step process. First, carbon nanotubes (CNTs) were coated onto stainless steel substrates using electrophoretic deposition (EPD) under constant current. Then, an electrochemical deposition (ECD) process was carried out using copper sulfate (II) solution under high overpotentials.
Sample Preparation
Copper sulfate (II) solutions with concentrations of 1 mM and 100 mM were prepared in distilled water. The electrochemical deposition (ECD) process was carried out on CNT-coated stainless steel plates using the same equipment as for EPD. Due to the different arrangement, two counter electrodes were used as the anodes, while the CNT-coated stainless steel plate was used as the cathode. The sample preparation was performed using 1 mM or 100 mM CuSO₄ solution, and a voltage of 7.0 V was applied during the ECD process for times of 60 s, 120 s, 180 s, 240 s, 300 s, 450 s, or 600 s. The samples were then cleaned with distilled water and dried at room temperature. Two series of samples were obtained: A1-A7 and B1-B7.

Effect of CuSO₄ Content on the Preparation of Copper-Coated Hardened Cement Paste (HCP)

Chu, Hongqiang, et al. Cement and Concrete Composites (2024): 105848.

This study investigates the effect of CuSO₄ concentration on the preparation of copper-coated hardened cement paste (HCP). When the CuSO₄ concentration is 10 g/L, a copper coating with high mass gain (0.3%) and Vickers hardness (212.0 HV) can be achieved.
The figure shows the deposition on the surface of HCP treated in plating solutions with different CuSO₄ concentrations at a constant pH of 7. As the CuSO₄ concentration increases, the copper coating on the HCP changes from red to purple, and the plated surface becomes denser.
Observations indicate that at a CuSO₄ concentration of 2 g/L, the red color does not fully cover the coating, suggesting incomplete coverage of the HCP. When the CuSO₄ concentration is increased to 6 g/L, the HCP surface is completely covered with a red layer that appears smooth and uniform. When the concentration exceeds 6 g/L, the HCP surface color shifts to purple, and the size of the coating particles becomes more evenly distributed.

Electrodeposition of Submicron/Nanoscale Cu₂O/Cu Junctions in an Ultrathin CuSO₄ Solution Layer

Yu, Guangwei, et al. Journal of Electroanalytical Chemistry 638.2 (2010): 225-230.

In an ultrathin CuSO₄ solution layer, electrodeposition experiments were conducted under a low growth driving force, and the deposited structures were characterized using FESEM. It was observed that Cu₂O grains were distributed across the entire sample surface, forming submicron/nanoscale Cu₂O/Cu junctions.
Experimental Methods
Electrodeposition was performed in an electrolytic cell consisting of a substrate and electrodes, placed horizontally in a thermostatic chamber. Glass slides or silicon wafers were used as substrates. Two parallel copper foils with a purity of 99.9% were fixed 10 mm apart on the substrate surface and served as the cathode and anode, respectively.
A droplet of CuSO₄ aqueous solution (0.05 mol/L, pH 4.5) was placed in the gap between the electrodes on the substrate. A cover slip was then placed over the electrodes to form an initial solution layer. By cooling the thermostatic chamber, an ultrathin CuSO₄ solution layer was formed between the substrate and a frozen CuSO₄ electrolyte ice layer. The temperature of the chamber was set to -3.5°C. The resistance of the ultrathin CuSO₄ solution layer was approximately 100 kΩ.
Under the applied growth driving force, electrodeposits grew from the cathode toward the anode. In the study, the deposition current in the constant current mode was less than or equal to 15 μA, and the deposition voltage in the constant potential mode was less than or equal to 1.2 V. The morphology of the electrodeposits was then observed in situ using a field emission scanning electron microscope (FESEM).

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