Copper(II) nitrate solution

Catalog Number	ACEP3251238
CAS Number	3251-23-8
Structure
Molecular Formula	Cu(NO3)2

Case Study

Copper Nitrate (II) Used in the Development of Low-Cost TiO₂/CuO/Cu Solar Cells via Electroplating

Rokhmat, Mamat, et al. Journal of Mathematical and Fundamental Sciences 50.1 (2018): 92-101.

In the current study, a low-cost TiO₂/CuO/Cu solar cell has been developed. The process involves several steps: spraying a TiO₂-CuO suspension onto an FTO surface, electroplating copper particles, adhering a polymer electrolyte, and fixing the electrodes.
Experimental Procedure
First, CuO particles were prepared from a 0.2 M copper nitrate (Cu(NO₃)₂) solution using a simple wet chemical method with the assistance of sodium hydroxide (NaOH). The concentration of NaOH varied in different experiments (0.5, 0.75, 1.0, and 1.5 M). An FTO substrate with an active area of 1 x 1 cm² was cleaned by immersion in distilled water for 20 minutes and alcohol for 40 minutes using an ultrasonic bath. To prepare the TiO₂ suspension, 5 g of TiO₂ and CuO powders were mixed in 20 mL of distilled water and stirred with a magnetic stirrer to ensure uniform dispersion. The TiO₂/CuO mixture was sprayed onto the FTO surface under 120 psi pressure. The FTO/TiO₂/CuO film was then heated on a hotplate at 200°C for 10 minutes and further heated in a furnace at 450°C for 30 minutes.
To grow copper particles on the spaces between TiO₂/CuO particles, an electroplating process was used, with the method being further explored by employing an alternative source (i.e., a current source instead of a voltage source). A polymer electrolyte made of PVA and LiOH was also utilized. A prototype solar cell was constructed by clamping the FTO/TiO₂/CuO/Cu thin film, polymer electrolyte, and aluminum counter electrode together. Finally, NaOH post-treatment was applied to improve the contact between the counter electrode, electrolyte, and thin film.

Copper Nitrate Solution Used for Electroplating the Synthesis of Novel Spruce Leaf-Like CuBi₂O₄ Microstructures

Ahmed, AL-Osta, et al. Microelectronic Engineering 229 (2020): 111359.

A simple and cost-effective electroplating chemical approach was used to deposit a novel spruce leaf-like copper bismuth oxide (CuBi₂O₄) microstructure film on stainless steel (SS) substrates.
Synthesis of CuBi₂O₄
CuBi₂O₄ was synthesized from a solution containing 0.1 M bismuth nitrate and 0.05 M copper nitrate, stirred for 1 hour in 50 mL of distilled water. In another beaker, 0.2 M citric acid was dissolved in 6 mL of acetic acid solution and stirred for 1 hour. This prepared solution was then added to the electrolyte, and the mixture was stirred continuously for 1 hour. Excess ammonium hydroxide was added, and the solution was stirred for 30 minutes to maintain a pH of approximately 12.
The SS substrate (1×1 cm²), made of stainless steel containing approximately 12% chromium and other alloy elements below 2%, was polished using 600-grade sandpaper, then cleaned using an ultrasonic bath in 5% HCl solution for 10 minutes, followed by rinsing with distilled water and ethanol to remove surface impurities (if any).
For electroplating, a platinum plate was used as the anode, and the SS substrate as the cathode, maintaining a 1.5 cm distance between the electrodes. A constant current density of 2 mA cm⁻² was applied between the electrodes for 10 minutes. The electroplating process was carried out using an alternating current method. After electroplating, the deposited electrode was washed with distilled water and air-fired at 200°C, 300°C, 400°C, and 500°C for 1 hour. The resulting electrodes were then characterized and subjected to electrochemical measurements.

Preparation of Cu(II) Surface Ion-Imprinted Sugarcane Bagasse from Copper Nitrate Solution

Yu, Jun-xia, et al. Colloids and Surfaces A: Physicochemical and Engineering Aspects 639 (2022): 128394.

Electroplating sludge containing heavy metal copper is not only a toxic and harmful solid waste but also a valuable resource that can be recycled. This study developed a novel Cu(II) ion-imprinted sugarcane bagasse, which was used as an adsorbent to selectively recover copper from the leachate of electroplating sludge.
Preparation of Cu(II) Surface Ion-Imprinted Sugarcane Bagasse
The preparation of surface ion-imprinted sugarcane bagasse consists of two steps. First, sugarcane bagasse modified with tetraethylenepentamine was obtained based on our previous research. Specifically, 10 g of sugarcane bagasse, 250 mL of 2.5 mol/L NaOH solution, and 125 mL of epichlorohydrin were added into a 500 mL three-neck flask. After stirring for 1 hour in a 60°C water bath, the suspension was separated and washed to remove excess epichlorohydrin. The resulting sugarcane bagasse was then added to 10 mL of tetraethylenepentamine in 100 mL of 0.1 mol/L Na₂CO₃ solution, and the reaction was carried out under a nitrogen atmosphere at 70°C for 3 hours. The tetraethylenepentamine-modified sugarcane bagasse was collected, washed with ethanol and distilled water, and freeze-dried for later use.
In the second step, glutaraldehyde was used as a crosslinking agent, and Cu(II) was used as the template ion to synthesize Cu(II) surface-imprinted sugarcane bagasse. To do this, 0.2 g of tetraethylenepentamine-modified sugarcane bagasse was added to 50 mL of 0.02 mol/L Cu(NO₃)₂ solution, and after 1 hour of adsorption in the dark, 0.4 mL of glutaraldehyde was added. The reaction continued at room temperature for 5 hours. Then, the adsorbed Cu(II) was eluted using a 0.05 mol/L ethylenediaminetetraacetic acid disodium (Na₂EDTA) solution to obtain the ion-imprinted sugarcane bagasse.

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