Copper(II) fluoroborate solution

Catalog Number	ACEP207121399
CAS Number	207121-39-9
Molecular Formula	Cu(BF4)2

Case Study

Copper Base Fabrication from Cu(BF₄)₂ Precursor on Au/Si via Electrodeposition

Akbari, Raziyeh, et al. Coatings 12.9 (2022): 1260.

Electrodeposition is an effective and scalable method for growing desired structures on solid surfaces, such as those that impart superhydrophobicity. In this study, copper base layers were fabricated on Au/Si(100) substrates from a Cu(BF₄)₂ precursor using cyclic voltammetry and square wave pulse voltage methods.
A 0.1 M aqueous solution of copper(II) tetrafluoroborate Cu(BF₄)₂ was prepared with a pH of 3.15. Copper and copper oxide were deposited on Au/Si(100) substrates at bath temperatures of 22°C, 45°C, and 60°C using cyclic voltammetry and square wave pulse voltage. The electrochemical system consisted of a Metrohm Autolab potentiostat with three connected electrodes: (i) a 150 nm gold film on a Si(100) wafer as the working electrode, (ii) a carbon rod as the counter electrode, and (iii) a saturated calomel electrode (SCE) as the reference electrode.
For square wave pulse voltage deposition (referred to as "pulse"), each deposition cycle consisted of 10 seconds of deposition at a fixed working voltage of EW = -0.3 V, followed by 2 seconds of relaxation at 0 V, following our previous research. The deposition cycle was repeated 8 or 12 times at the three bath temperatures. For cyclic voltammetry deposition (referred to as "CV"), the voltage was cycled in the range of [-0.3, 0] V at a scan rate of 20 mV/s for 3 or 5 cycles at the three bath temperatures.
The prepared samples were cleaned in distilled water and dried for one week under ambient conditions in a sealed glass container before characterization.

Fluoroborate Copper Electrolyte for Sn-Cu Alloy Electrodeposition

Wu, Liang, and Andrew J. Cobley. Thin Solid Films 683 (2019): 118-127.

Sn-Cu alloy electrodeposition has widespread applications in the electronics, automotive, and aerospace industries. The current study thoroughly investigates the electrodeposition of Sn-Cu alloy coatings produced from a fluoroborate-based electrolyte.
Experiment
Sn-Cu alloy deposits were produced using a proprietary electrolyte containing tin fluoroborate, copper fluoroborate, fluoroborate, and antioxidants. A pure tin plate was used as the anode for the electrodeposition of the Sn-Cu alloy coating. Prior to electrodeposition, both the cathode and anode materials were cleaned with a detergent (Decon 90), followed by a 1-minute acid treatment in 30 vol% hydrochloric acid solution (specific gravity (SG) 1.16) to remove surface oxides. The materials were then rinsed with deionized water and dried with hot air. The electrodeposition process was carried out at different cathodic current densities (0.5 to 5 A dm⁻²) with varying deposition times to achieve a consistent thickness of 10 μm.

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