SLP Acid Copper Intermediates

Catalog Number	ACEP2023002
Description	SLP has very good throwing power and covering powder, especially is excellent in LCD leveling. It's normally used as an intermediate of acid copper additive for printed circuit board plating. SLP is very suitable for printed circuit board through-hole filling. No negative effects occurs if SLP is too much in baths, whereas the more SLP is added to baths, the better effects will be in LCD.
Appearance	Clear Transparent Liquid
Application	Throwing power, leveling agent in LCD area for acid copper plating baths
Storage	Stored in cool and dry place.
Concentration	≥50%
Concentration In Bath	0.02-0.05 ml/L
Consumption	1-1.5 ml/KAH
High Light	Copper plating additives, electroplating intermediates
Packaging	25kg. Packed in a plastic drum

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