PUB(Polyquaternium-2)

Catalog Number	ACEP68555362-1
CAS Number	68555-36-2
Structure
Synonyms	PUB
Molecular Formula	(C11H26N4O)n·(C4H8Cl2O)n
Boiling Point	105ºC
Density	1.13 g/cm3 at 25℃
Appearance	Colorless to yellowish clear liquid
Application	1. It is a polyurea ammonium salt cationic surfactant, which is mainly used in alkaline zinc plating. It can effectively uniform the coating thickness in high and low areas. 2. It can also be used in cosmetics, shampoos, skin care and detergents.
Assay	60%
Chemical Name	Diaminoarea polymer
pH	7.0-8.5 (10wt% in solution)
Refractive Index	1.468
Viscosity	≤3000mPa·s at 25℃

Case Study

Effect of BPC and Polyquaternium-2 on Alkaline Cyanide-Free Zinc Plating

Chotirach, Maslin, et al. Materials Chemistry and Physics 277 (2022): 125567.

This study aims to evaluate the changes in the brightener content in the zinc plating solution using HPLC technology and their effects on the corresponding microstructure and coating characteristics. 1-Benzylpyridine-3-carboxylate (BPC) and Polyquaternium-2 were used as brighteners and leveling agents, respectively, to prepare alkaline cyanide-free zinc plating solutions.
SEM images of zinc coatings with different additive compositions clearly indicate that the presence of additives affects the development of surface morphology and crystal structure. Zinc coatings prepared without additives exhibited a rough surface and dendritic structures. After adding BPC, flower-like clusters were formed, and after adding Polyquaternium-2, needle-like morphology was observed. Zinc coatings prepared with BPC alone had rougher and larger grains compared to those prepared with Polyquaternium-2. This result is consistent with the bonding energy results, indicating that Polyquaternium-2 has excellent stability in the electroplating bath.

Polyquaternium-2: A New Leveling Agent for Acidic Sulfate Copper Plating

Chen, Biao, et al. Electrochemistry 84.6 (2016): 414-419.

Polyquaternium-2 was used as a leveling agent in acidic sulfate through-hole (TH) copper plating experiments. The interaction between Polyquaternium-2 and the copper surface was studied using field emission scanning electron microscopy (FESEM) and X-ray photoelectron spectroscopy (XPS).
Polished and cleaned copper surfaces treated without Polyquaternium-2 were used as a comparison. The left images (a and b) show FE-SEM images of polished and cleaned copper surfaces with and without Polyquaternium-2 treatment, respectively. As seen in image a, numerous grooves appeared during the polishing process. In contrast, image b shows a completely different morphology. The copper surface exhibits many small particles with diameters of approximately 20-50 nm. Furthermore, once these small particles cover the copper surface, the grooves formed during polishing are almost invisible. It can be inferred that the adsorbed Polyquaternium-2 altered the morphology of the copper surface.
Right image a shows the XPS spectrum of the copper surface treated with Polyquaternium-2. The binding energy of the C1s peak at 284.8 eV was used as an internal standard. The full XPS scan in image a covers a wide binding energy range, indicating the presence of carbon, nitrogen, oxygen, copper, and chlorine species. For comparison, right image b shows the XPS spectrum of the untreated copper surface. Unlike image a, no significant N1s and Cl2p peaks were observed in image b.

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