Copper(II) chloride dihydrate

Catalog Number	ACEP10125130
CAS Number	10125-13-0
Molecular Formula	CuCl2·2 H2O

Case Study

One-Step Electroplating of Superhydrophobic Copper Coating Using CuCl₂·2H₂O Ionic Liquid

Kuang, Yilong, et al. Materials Letters 303 (2021): 130579.

A one-step electroplating method for preparing micro-nano superhydrophobic structures on copper surfaces was developed using choline chloride (ChCl)-based ionic liquid as the electrolyte.
In this experiment, the ionic liquid was composed of choline chloride (ChCl) and ethylene glycol (EG) in a molar ratio of 1:2. The mixture was continuously stirred magnetically at 70°C until a colorless and transparent liquid was formed. Then, CuCl₂·2H₂O (0.15 M), 1 wt% stearic acid ethanol solution (20 mL), and salicylic acid (C₇H₆O₃, 0.01 M) were added to the ChCl and ethylene glycol mixture, and stirring continued until the solution became uniform.
The electroplating of the coating was conducted using a two-electrode system, with a copper sheet as the anode and a copper block as the cathode. Prior to electroplating, the electrodes were polished with 800#, 1000#, and 1200# SiC sandpaper and then ultrasonically cleaned in anhydrous ethanol for 10 minutes. Finally, they were acid-washed in a 10 wt% hydrochloric acid solution for 30 seconds to remove oxides from the metal surface. The electroplating experiment was carried out at 70°C, with a current density of 5 mA/cm² and an electroplating time of 10 minutes. After electroplating, the coating was rinsed with deionized water, dried, and characterized and tested.

Preparation of Copper-Manganese Superhydrophobic Coating Using CuCl₂·2H₂O Electroplating Solution

Tang, Liming, et al. Colloids and Surfaces A: Physicochemical and Engineering Aspects 692 (2024): 134032.

A simple one-step electroplating technique was used to prepare a superhydrophobic Cu/Mn (SCM) coating on the surface of carbon steel.
Before electroplating, the carbon steel plates were polished with 180, 400, and 1200 grit metallographic sandpapers until the surface showed no obvious scratches. The plates were then ultrasonically cleaned sequentially in acetone and deionized water. The carbon steel plates were pretreated using an electro-polishing method with Ti-IrO₂ as the anode and the carbon steel plate as the cathode. The alkaline electrolyte solution consisted of 8 g/L KOH, 8 g/L sodium dodecyl sulfate (SDS), and 60 g/L Na₂CO₃. The current density was 0.02 A/cm², and the electrolysis time was 2 minutes. After the natural oxide layer on the surface was immersed in a 10% HCl solution for 30 seconds, it was rinsed with deionized water and dried with a hairdryer set to cold air.
After drying the samples, electroplating was immediately carried out using an electroplating solution containing CuCl2·2H₂O, MnCl2·4H₂O, 4 g/L C₁₄H₂₈O₂, 30 g/L H₃BO₃, and 4 g/L SDS. The pH of the solution was adjusted to 4 using 30 g/L H₃BO₃. Ti-IrO₂ was used as the anode, and the carbon steel plate as the cathode. The plating solution was kept at a constant temperature of 60°C in a water bath. During the entire electroplating process, a DC power supply was used to power the electrodes, and the anode-cathode distance was maintained at a constant 2 cm.

Preparation of Superhydrophobic Copper Mesh Using CuCl₂·2H₂O Electrolyte

Jie, Pan, et al. International Journal of Electrochemical Science 19.1 (2024): 100417.

A micro-nano superhydrophobic structure was fabricated on the surface of copper mesh using an electroplating method with choline chloride/ethylene glycol ionic liquid and copper(II) chloride dihydrate as the electrolyte.
Electrolyte Preparation:
Choline chloride and ethylene glycol were mixed in a 1:2 molar ratio. Then, 0.1 mol of copper(II) chloride dihydrate was added to the mixture, and the solution was stirred in a 70°C water bath until the copper(II) chloride dihydrate completely dissolved, resulting in a uniform brown solution.
Preparation of Superhydrophobic Copper Mesh:
The preparation of the superhydrophobic copper mesh involved two steps. First, a copper mesh (30 mm × 20 mm × 1 mm) and a copper plate (60 mm × 30 mm × 5 mm) were ultrasonically cleaned in anhydrous ethanol for 10 minutes, then immersed in 10% hydrochloric acid for 30 seconds to remove surface oxides. Finally, the samples were immersed in 15% nitric acid for 2 minutes to activate the surface.
The activated copper mesh was then immersed in the prepared electrolyte and electroplated under different deposition times (2-7 minutes) and deposition currents (0.2 A-2 A) to form various micro-nano structures on the copper mesh surface. All experiments were conducted at 25°C. After electroplating, the samples were ultrasonically cleaned in anhydrous ethanol for 5 minutes, then soaked in a 0.05 mol/L stearic acid ethanol solution at 25°C for 2 hours. The samples were then washed sequentially with anhydrous ethanol and deionized water and dried with cold air.

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